Production facilities

• Diameter: 18–80 mm
• Chip removal: 1–5 mm
• Length: 2.8–8 m

• Diameter: 18–80 mm
• Length: 2.8–8 m

• Diameter: 20–115 mm
• Chip removal: 1–5 mm
• Length: 2.8–8 m

• Diameter: 20–115 mm
• Length: 2.8–8 m

• Diameter: 18–70 mm
• Length: 1.8–8 m

• Rotating head: 18–115
• Length: 2–8.2 m

• Rotating head: 18–50 / 50-100 mm
• Length: 2–8.2 m
• phase-array-testing technology

• Diameter: 18–80 mm
• Fixed length: 20–3.500 mm
• Tolerance: +/- 0.15 mm
• Length: 1.5–8 m
  (valid as at Nov. 2005)

• Diameter: 18–80 mm
• Chamfer angle: 30°/45°/60°
• Chamfer depth: 0.5–6 mm
• Processing: on 1 or 2 sides
• Length: max. 8 m